| Lithographic systems and methods of operating the same |
2022-12-05 |
2023-3-30 |
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| Ultrasonic transducer systems including tuned resonators, equipment including … |
2022-10-25 |
2022-11-07 |
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| Methods of optimizing clamping of a semiconductor element against a support … |
2022-10-24 |
2023-2-09 |
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| Ultrasonic welding systems and methods of using the same |
2022-10-19 |
2023-2-09 |
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| Methods of transferring a die from a carrier to a receive substrate, and … |
2022-9-21 |
2023-4-06 |
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| Method of generating wire loop profile for wire loop and method of verifying … |
2022-9-20 |
2022-12-20 |
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| Method of parallelly assembling discrete components on substrate |
2022-8-24 |
2022-11-18 |
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| Method of mounting wire bonding tool on wire bonding system and related … |
2022-7-15 |
2023-4-14 |
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| Methods of detecting bonding between a bonding wire and a bonding location on a … |
2022-6-29 |
2022-10-13 |
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| Methods of installing wire bonding tools on wire bonding systems, and related … |
2022-6-21 |
2023-4-13 |
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| Electronic component bonding machines, and methods of measuring a distance on … |
2022-5-31 |
2022-12-01 |
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| Wire bonding machines including linear motor systems |
2022-5-24 |
2022-11-22 |
2022-11-22 |
| Methods of determining and/or calibrating a cutter height on a wedge bonding … |
2022-5-19 |
2022-11-24 |
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| Systems and methods for perforating flexible films, and related punching tools |
2022-4-21 |
2022-8-04 |
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| Ultrasonic transducer, wire bonding machine including ultrasonic transducer, … |
2022-4-20 |
2022-10-28 |
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| Method for determining bonding free air ball shearing strength on wire bonding … |
2022-2-23 |
2022-8-30 |
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| Intelligent pattern recognition systems for wire bonding and other electronic … |
2022-2-17 |
2022-7-21 |
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| Systems and methods for optimizing looping parameters and looping trajectories … |
2022-2-03 |
2022-5-19 |
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| Method of forming lead interconnect structure and related wire bonding tool |
2021-12-17 |
2022-7-08 |
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| Method for detecting connection problem between wire bonding tool and … |
2021-12-15 |
2022-7-05 |
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| Methods of operating a wire bonding machine, including methods of monitoring an … |
2021-11-03 |
2022-8-01 |
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| Reusable die catch materials, reusable die release materials, related die … |
2021-9-22 |
2022-3-24 |
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| Methods of bonding of semiconductor elements to substrates, and related bonding … |
2021-8-26 |
2021-12-16 |
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| Dynamic release tapes for assembly of discrete components |
2021-8-12 |
2021-12-02 |
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| Laser welding systems including in connection with battery systems, and related … |
2021-8-09 |
2022-6-16 |
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| Wire bonding tool |
2021-6-18 |
2021-12-21 |
2021-12-21 |
| Ovens for equipment such as die attach systems, flip chip bonding systems, clip … |
2021-6-17 |
2022-1-01 |
|
| Ultrasonic welding systems, methods of using them, and related works including … |
2021-5-28 |
2023-2-09 |
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| Bonding tools for bonding machines, bonding machines for bonding semiconductor … |
2021-5-19 |
2021-9-02 |
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| Methods of bonding of semiconductor elements to substrates, and related bonding … |
2021-5-11 |
2021-8-26 |
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| Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy Assembly |
2021-2-01 |
2021-8-26 |
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| Adhesive tapes for receiving discrete components |
2020-12-07 |
2022-10-26 |
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| Ultrasonic welding systems and methods of using the same |
2020-11-25 |
2021-3-18 |
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| Methods of bonding semiconductor elements to a substrate, including use of a … |
2020-11-05 |
2021-2-25 |
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| Ribbon bonding tools and methods of using the same |
2020-10-15 |
2021-1-28 |
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| Wire bonding tool and method of forming the same |
2020-7-27 |
2021-12-07 |
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| Material for positional error compensation in assembly of discrete components |
2020-6-11 |
2022-4-20 |
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| Bonding detection method between bonding wire and bonding position of wire … |
2020-6-03 |
2022-1-12 |
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| Systems and methods for bonding semiconductor elements |
2020-5-12 |
2022-4-05 |
2022-4-05 |
| Wedge bonding tools, wedge bonding systems, and related methods |
2019-8-22 |
2019-12-12 |
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| Cleaning system for wire bonding tool, wire bonding machine including such … |
2019-1-30 |
2020-9-11 |
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| Bonding tools for bonding machines, bonding machines for bonding semiconductor … |
2019-1-23 |
2019-8-01 |
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| Operating system and method for wire bonding machine including clamping system |
2019-1-09 |
2020-8-21 |
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| Conductive terminal, bus bar, manufacturing method thereof and method for … |
2018-10-12 |
2020-5-26 |
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| Bonding and placement tools for bonding machines, bonding machines for bonding … |
2018-10-08 |
2019-7-01 |
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| On-bonder automatic overhang die optimization tool for wire bonding and related … |
2018-9-26 |
2020-5-26 |
2020-5-26 |
| Light beam diffuser system and method |
2018-5-15 |
2021-5-04 |
2021-5-04 |
| Wire bonding machine is operated to improve the method and wire bonding machine … |
2018-5-04 |
2018-11-13 |
|
| Ribbon bonding tools, and methods of designing ribbon bonding tools |
2018-4-30 |
2020-2-18 |
2020-2-18 |
| Parallel assembly of discrete components onto a substrate |
2018-4-25 |
2021-12-14 |
2021-12-14 |
| System and method for being bonded to semiconductor element |
2018-3-14 |
2018-9-25 |
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| System and method for being bonded to semiconductor element |
2018-3-13 |
2018-9-25 |
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| Systems and methods for bonding semiconductor elements |
2018-2-26 |
2019-6-04 |
2019-6-04 |
| Bonding machines for bonding semiconductor elements, methods of operating … |
2018-2-19 |
2019-11-05 |
2019-11-05 |
| Methods and systems for aligning tooling elements of ultrasonic bonding systems |
2018-2-15 |
2018-10-09 |
2018-10-09 |
| Welding assist system, welding machine including the same, and method of … |
2017-10-31 |
2021-8-17 |
2021-8-17 |
| Engagement head assembly, associated splice machine and correlation technique … |
2017-10-25 |
2018-5-01 |
|
| Systems and methods for measuring physical characteristics of semiconductor … |
2017-10-18 |
2019-7-16 |
2019-7-16 |
| Systems and methods for bonding semiconductor elements |
2017-10-02 |
2018-1-25 |
|
| Light beam homogenizer based on lens array |
2017-9-18 |
2022-6-10 |
2022-6-10 |
| Methods of forming wire interconnect structures |
2017-8-16 |
2018-12-11 |
2018-12-11 |
| Connecting electronic components to substrates |
2017-4-28 |
2022-5-11 |
2022-5-11 |
| Thermocompression bonding systems and methods of operating the same |
2017-4-19 |
2017-10-03 |
2017-10-03 |
| Systems and methods for bonding semiconductor elements |
2017-3-13 |
2017-6-29 |
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| Lithographic apparatus and method for preventing peripheral exposure of a … |
2017-2-15 |
2019-12-24 |
2019-12-24 |
| Placing ultra-small or ultra-thin discrete components |
2017-1-12 |
2020-8-18 |
2020-8-18 |
| Bond head assemblies, thermocompression bonding systems and methods of … |
2017-1-04 |
2017-4-27 |
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| Bond heads for thermocompression bonders, thermocompression bonders, and … |
2016-7-22 |
2016-11-10 |
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| Thermocompression bonders, methods of operating thermocompression bonders, and … |
2016-5-20 |
2016-11-30 |
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| Thermocompression bonders, methods of operating thermocompression bonders, and … |
2016-4-22 |
2016-11-02 |
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| Photolithography apparatus comprising projection system for control of image … |
2015-10-23 |
2017-5-04 |
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| Methods of operating bonding machines for bonding semiconductor elements, and … |
2015-9-16 |
2016-10-25 |
2016-10-25 |
| Systems and methods for determining and adjusting a level of parallelism … |
2015-8-07 |
2015-12-31 |
|
| Thermocompression bonders, methods of operating thermocompression bonders, and … |
2015-6-30 |
2016-1-07 |
|
| Ribbon bonding tools and methods of using the same |
2015-5-06 |
2018-3-27 |
2018-3-27 |
| Short tail recovery techniques in wire bonding operations |
2015-1-14 |
2015-7-16 |
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| Electronic device incorporated into a sheet |
2014-12-04 |
2016-10-20 |
|
| Systems and methods for processing solar substrates |
2014-9-26 |
2016-12-27 |
2016-12-27 |
| Automatic rework processes for non-stick conditions in wire bonding operations |
2014-3-04 |
2014-9-10 |
|
| Ultrasonic bonding systems and methods of using the same |
2013-7-22 |
2013-11-21 |
|
| Ultrasonic bonding systems and methods of using the same |
2013-7-15 |
2013-11-05 |
2013-11-05 |
| For the diameter wire on wire bonder being changed the method and system … |
2013-7-01 |
2016-8-24 |
2016-8-24 |
| The method of the ultrasonic bond energy in adjustment wire bonder |
2013-4-22 |
2017-6-23 |
2017-6-23 |
| Wire bonding system and method of forming a wire loop |
2013-2-05 |
2022-12-15 |
2022-12-15 |
| Ribbon bonding in an electronic package |
2013-1-25 |
2013-5-30 |
|
| Wire loop forming systems and methods of using the same |
2013-1-22 |
2015-4-07 |
2015-4-07 |
| Wire bonding tool |
2012-9-13 |
2014-7-03 |
|
| Method and apparatus for inspecting a semiconductor chip prior to bonding |
2012-7-31 |
2013-2-06 |
|
| Ultrasonic transducers for wire bonding and methods of forming wire bonds using … |
2012-7-25 |
2012-11-15 |
|
| Solar substrate ribbon bonding system |
2012-7-02 |
2012-11-13 |
2012-11-13 |
| Solar substrate ribbon bonding system |
2012-4-19 |
2012-8-16 |
|
| Wire feed system and method of operating the same |
2012-3-07 |
2012-6-28 |
|
| Systems and methods for processing ribbon and wire in ultrasonic bonding … |
2012-1-12 |
2013-11-07 |
|
| Imaging operations for a wire bonding system |
2011-11-23 |
2012-7-11 |
|
| Gas delivery system for reducing oxidation in wire bonding operations |
2011-10-13 |
2012-2-09 |
|
| Methods of forming wire bonds for wire loops and conductive bumps |
2011-9-27 |
2012-4-01 |
|
| Wire loops, methods of forming wire loops, and related processes |
2011-8-03 |
2013-5-23 |
|
| Ultrasonic bonding systems including workholder and ribbon feeding system |
2011-7-18 |
2014-2-18 |
2014-2-18 |
| Methods of operating of a wire bonding machine |
2011-6-23 |
2012-4-19 |
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| Method of teaching eyepoints for wire bonding and related semiconductor … |
2011-3-28 |
2011-7-21 |
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