Latest Patents

Patents imply intellectual property and it has a $ value that can be associated depending on the field and type of patent that is allocated. Patents also increase the enterprise value of the company and help prevent copy-cats from copying the idea without having royalt payments or licencing deals. We like it when companies get patents awarded!. To protect IP companies aggressively file provisional patents even before they have a working product. The below table provides a way to look at what has been done by companies and use this as a factor to make investment decisions.

     
Title Filing Date Publication Date Grant Date
Lithographic systems and methods of operating the same 2022-12-05 2023-3-30
Ultrasonic transducer systems including tuned resonators, equipment including … 2022-10-25 2022-11-07
Methods of optimizing clamping of a semiconductor element against a support … 2022-10-24 2023-2-09
Ultrasonic welding systems and methods of using the same 2022-10-19 2023-2-09
Methods of transferring a die from a carrier to a receive substrate, and … 2022-9-21 2023-4-06
Method of generating wire loop profile for wire loop and method of verifying … 2022-9-20 2022-12-20
Method of parallelly assembling discrete components on substrate 2022-8-24 2022-11-18
Method of mounting wire bonding tool on wire bonding system and related … 2022-7-15 2023-4-14
Methods of detecting bonding between a bonding wire and a bonding location on a … 2022-6-29 2022-10-13
Methods of installing wire bonding tools on wire bonding systems, and related … 2022-6-21 2023-4-13
Electronic component bonding machines, and methods of measuring a distance on … 2022-5-31 2022-12-01
Wire bonding machines including linear motor systems 2022-5-24 2022-11-22 2022-11-22
Methods of determining and/or calibrating a cutter height on a wedge bonding … 2022-5-19 2022-11-24
Systems and methods for perforating flexible films, and related punching tools 2022-4-21 2022-8-04
Ultrasonic transducer, wire bonding machine including ultrasonic transducer, … 2022-4-20 2022-10-28
Method for determining bonding free air ball shearing strength on wire bonding … 2022-2-23 2022-8-30
Intelligent pattern recognition systems for wire bonding and other electronic … 2022-2-17 2022-7-21
Systems and methods for optimizing looping parameters and looping trajectories … 2022-2-03 2022-5-19
Method of forming lead interconnect structure and related wire bonding tool 2021-12-17 2022-7-08
Method for detecting connection problem between wire bonding tool and … 2021-12-15 2022-7-05
Methods of operating a wire bonding machine, including methods of monitoring an … 2021-11-03 2022-8-01
Reusable die catch materials, reusable die release materials, related die … 2021-9-22 2022-3-24
Methods of bonding of semiconductor elements to substrates, and related bonding … 2021-8-26 2021-12-16
Dynamic release tapes for assembly of discrete components 2021-8-12 2021-12-02
Laser welding systems including in connection with battery systems, and related … 2021-8-09 2022-6-16
Wire bonding tool 2021-6-18 2021-12-21 2021-12-21
Ovens for equipment such as die attach systems, flip chip bonding systems, clip … 2021-6-17 2022-1-01
Ultrasonic welding systems, methods of using them, and related works including … 2021-5-28 2023-2-09
Bonding tools for bonding machines, bonding machines for bonding semiconductor … 2021-5-19 2021-9-02
Methods of bonding of semiconductor elements to substrates, and related bonding … 2021-5-11 2021-8-26
Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy Assembly 2021-2-01 2021-8-26
Adhesive tapes for receiving discrete components 2020-12-07 2022-10-26
Ultrasonic welding systems and methods of using the same 2020-11-25 2021-3-18
Methods of bonding semiconductor elements to a substrate, including use of a … 2020-11-05 2021-2-25
Ribbon bonding tools and methods of using the same 2020-10-15 2021-1-28
Wire bonding tool and method of forming the same 2020-7-27 2021-12-07
Material for positional error compensation in assembly of discrete components 2020-6-11 2022-4-20
Bonding detection method between bonding wire and bonding position of wire … 2020-6-03 2022-1-12
Systems and methods for bonding semiconductor elements 2020-5-12 2022-4-05 2022-4-05
Wedge bonding tools, wedge bonding systems, and related methods 2019-8-22 2019-12-12
Cleaning system for wire bonding tool, wire bonding machine including such … 2019-1-30 2020-9-11
Bonding tools for bonding machines, bonding machines for bonding semiconductor … 2019-1-23 2019-8-01
Operating system and method for wire bonding machine including clamping system 2019-1-09 2020-8-21
Conductive terminal, bus bar, manufacturing method thereof and method for … 2018-10-12 2020-5-26
Bonding and placement tools for bonding machines, bonding machines for bonding … 2018-10-08 2019-7-01
On-bonder automatic overhang die optimization tool for wire bonding and related … 2018-9-26 2020-5-26 2020-5-26
Light beam diffuser system and method 2018-5-15 2021-5-04 2021-5-04
Wire bonding machine is operated to improve the method and wire bonding machine … 2018-5-04 2018-11-13
Ribbon bonding tools, and methods of designing ribbon bonding tools 2018-4-30 2020-2-18 2020-2-18
Parallel assembly of discrete components onto a substrate 2018-4-25 2021-12-14 2021-12-14
System and method for being bonded to semiconductor element 2018-3-14 2018-9-25
System and method for being bonded to semiconductor element 2018-3-13 2018-9-25
Systems and methods for bonding semiconductor elements 2018-2-26 2019-6-04 2019-6-04
Bonding machines for bonding semiconductor elements, methods of operating … 2018-2-19 2019-11-05 2019-11-05
Methods and systems for aligning tooling elements of ultrasonic bonding systems 2018-2-15 2018-10-09 2018-10-09
Welding assist system, welding machine including the same, and method of … 2017-10-31 2021-8-17 2021-8-17
Engagement head assembly, associated splice machine and correlation technique … 2017-10-25 2018-5-01
Systems and methods for measuring physical characteristics of semiconductor … 2017-10-18 2019-7-16 2019-7-16
Systems and methods for bonding semiconductor elements 2017-10-02 2018-1-25
Light beam homogenizer based on lens array 2017-9-18 2022-6-10 2022-6-10
Methods of forming wire interconnect structures 2017-8-16 2018-12-11 2018-12-11
Connecting electronic components to substrates 2017-4-28 2022-5-11 2022-5-11
Thermocompression bonding systems and methods of operating the same 2017-4-19 2017-10-03 2017-10-03
Systems and methods for bonding semiconductor elements 2017-3-13 2017-6-29
Lithographic apparatus and method for preventing peripheral exposure of a … 2017-2-15 2019-12-24 2019-12-24
Placing ultra-small or ultra-thin discrete components 2017-1-12 2020-8-18 2020-8-18
Bond head assemblies, thermocompression bonding systems and methods of … 2017-1-04 2017-4-27
Bond heads for thermocompression bonders, thermocompression bonders, and … 2016-7-22 2016-11-10
Thermocompression bonders, methods of operating thermocompression bonders, and … 2016-5-20 2016-11-30
Thermocompression bonders, methods of operating thermocompression bonders, and … 2016-4-22 2016-11-02
Photolithography apparatus comprising projection system for control of image … 2015-10-23 2017-5-04
Methods of operating bonding machines for bonding semiconductor elements, and … 2015-9-16 2016-10-25 2016-10-25
Systems and methods for determining and adjusting a level of parallelism … 2015-8-07 2015-12-31
Thermocompression bonders, methods of operating thermocompression bonders, and … 2015-6-30 2016-1-07
Ribbon bonding tools and methods of using the same 2015-5-06 2018-3-27 2018-3-27
Short tail recovery techniques in wire bonding operations 2015-1-14 2015-7-16
Electronic device incorporated into a sheet 2014-12-04 2016-10-20
Systems and methods for processing solar substrates 2014-9-26 2016-12-27 2016-12-27
Automatic rework processes for non-stick conditions in wire bonding operations 2014-3-04 2014-9-10
Ultrasonic bonding systems and methods of using the same 2013-7-22 2013-11-21
Ultrasonic bonding systems and methods of using the same 2013-7-15 2013-11-05 2013-11-05
For the diameter wire on wire bonder being changed the method and system … 2013-7-01 2016-8-24 2016-8-24
The method of the ultrasonic bond energy in adjustment wire bonder 2013-4-22 2017-6-23 2017-6-23
Wire bonding system and method of forming a wire loop 2013-2-05 2022-12-15 2022-12-15
Ribbon bonding in an electronic package 2013-1-25 2013-5-30
Wire loop forming systems and methods of using the same 2013-1-22 2015-4-07 2015-4-07
Wire bonding tool 2012-9-13 2014-7-03
Method and apparatus for inspecting a semiconductor chip prior to bonding 2012-7-31 2013-2-06
Ultrasonic transducers for wire bonding and methods of forming wire bonds using … 2012-7-25 2012-11-15
Solar substrate ribbon bonding system 2012-7-02 2012-11-13 2012-11-13
Solar substrate ribbon bonding system 2012-4-19 2012-8-16
Wire feed system and method of operating the same 2012-3-07 2012-6-28
Systems and methods for processing ribbon and wire in ultrasonic bonding … 2012-1-12 2013-11-07
Imaging operations for a wire bonding system 2011-11-23 2012-7-11
Gas delivery system for reducing oxidation in wire bonding operations 2011-10-13 2012-2-09
Methods of forming wire bonds for wire loops and conductive bumps 2011-9-27 2012-4-01
Wire loops, methods of forming wire loops, and related processes 2011-8-03 2013-5-23
Ultrasonic bonding systems including workholder and ribbon feeding system 2011-7-18 2014-2-18 2014-2-18
Methods of operating of a wire bonding machine 2011-6-23 2012-4-19
Method of teaching eyepoints for wire bonding and related semiconductor … 2011-3-28 2011-7-21